Deformation and fracture behaviour of electroplated Sn–Bi/Cu solder joints
Crossref DOI link: https://doi.org/10.1007/s10853-015-8978-0
Published Online: 2015-03-25
Published Print: 2015-06
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Goh, Yingxin
Haseeb, A. S. M. A.
Liew, Haw Ling
Sabri, Mohd Faizul Mohd
Funding for this research was provided by:
University of Malaya High Impact Research Grant (UM.C/HIR/MOHE/ENG/26 (D000026-16001))
Text and Data Mining valid from 2015-03-25