Li, Chang
Xu, Yi-Tao
Zhao, Bo
Jiang, Li
Chen, Shi-Guo
Xu, Jian-Bin
Fu, Xian-Zhu
Sun, Rong
Wong, Ching-Ping
Funding for this research was provided by:
National Natural Science Foundation of China (No.21203236)
Guangdong and Shenzhen Innovative Research Team Program (No.2011D052, KYPT20121228160843692)
Cooperation project of Chinese Academy of Sciences and Hubei Province, Shenzhen Electronic Packaging Materials Engineering Laboratory
Shenzhen High Density Electronic Packaging and Device Assembly Key Laboratory (ZDSYS20140509174237196)
Shenzhen Electronic Packaging Materials Engineering Laboratory (2012-372)