Copper pastes using bimodal particles for flexible printed electronics
Crossref DOI link: https://doi.org/10.1007/s10853-015-9498-7
Published Online: 2015-10-20
Published Print: 2016-02
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Tam, Sze Kee
Fung, Ka Yip
Ng, Ka Ming
Text and Data Mining valid from 2015-10-20