The thermal conductivity of defected copper at finite temperatures
Crossref DOI link: https://doi.org/10.1007/s10853-019-04267-0
Published Online: 2019-12-06
Published Print: 2020-04
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Ye, X. B.
He, Z. H.
Pan, B. C. http://orcid.org/0000-0002-5128-7860
Funding for this research was provided by:
National Natural Science Foundation of China (11275191)
Text and Data Mining valid from 2019-12-06
Version of Record valid from 2019-12-06
Article History
Received: 27 August 2019
Accepted: 29 November 2019
First Online: 6 December 2019