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The thermal conductivity of defected copper at finite temperatures

Crossref DOI link: https://doi.org/10.1007/s10853-019-04267-0

Published Online: 2019-12-06

Published Print: 2020-04

Update policy: https://doi.org/10.1007/springer_crossmark_policy

Authors

Ye, X. B.

He, Z. H.

Pan, B. C. https://orcid.org/0000-0002-5128-7860
Funding

Funding for this research was provided by:

National Natural Science Foundation of China (11275191)
License Information

Text and Data Mining valid from 2019-12-06

Version of Record valid from 2019-12-06
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Article History

Received: 27 August 2019

Accepted: 29 November 2019

First Online: 6 December 2019