Geometrical size effect on the interface diffusion of micro solder joint in electro-thermal coupling aging
Crossref DOI link: https://doi.org/10.1007/s10854-014-2084-y
Published Online: 2014-06-21
Published Print: 2014-09
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Li, Xuemei
Sun, Fenglian
Liu, Yang
Zhang, Hao
Xin, Tong
Text and Data Mining valid from 2014-06-21