Effect of TiO2 addition concentration on the wettability and intermetallic compounds growth of Sn3.0Ag0.5Cu–xTiO2 nano-composite solders
Crossref DOI link: https://doi.org/10.1007/s10854-014-2094-9
Published Online: 2014-06-21
Published Print: 2014-09
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Li, Yi
Zhao, XiuChen
Liu, Ying
Wang, Yuan
Wang, Yong
Text and Data Mining valid from 2014-06-21