The effects of Mn powder additions on the microstructures and tensile property of SnAgCu/Cu solder joints
Crossref DOI link: https://doi.org/10.1007/s10854-014-2233-3
Published Online: 2014-08-09
Published Print: 2014-11
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Shen, Jun
He, Peipei
Zhang, Tao
Li, Yang
Pu, Yayun
Chen, Jie
Text and Data Mining valid from 2014-08-09