Microstructure and thermal expansion behavior of spray-formed Al–27Si alloy used for electronic packaging
Crossref DOI link: https://doi.org/10.1007/s10854-014-2249-8
Published Online: 2014-08-22
Published Print: 2014-11
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Zhu, Xuewei
Wang, Richu
Peng, Chaoqun
Liu, Wenshui
Peng, Jian
Text and Data Mining valid from 2014-08-22