Formation and evolution of intermetallic layer structures at SAC305/Ag/Cu and SAC0705-Bi-Ni/Ag/Cu solder joint interfaces after reflow and aging
Crossref DOI link: https://doi.org/10.1007/s10854-014-2257-8
Published Online: 2014-08-22
Published Print: 2014-11
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Liu, Yang
Meerwijk, Joost
Luo, Liangliang
Zhang, Honglin
Sun, Fenglian
Yuan, Cadmus A.
Zhang, Guoqi
Text and Data Mining valid from 2014-08-22