Investigation on the intermetallic compound layer growth of Sn–0.5Ag–0.7Cu–xGa/Cu solder joints during isothermal aging
Crossref DOI link: https://doi.org/10.1007/s10854-014-2288-1
Published Online: 2014-09-10
Published Print: 2014-12
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Luo, Dong-xue
Xue, Song-bai
Liu, Shuang
Text and Data Mining valid from 2014-09-10