Effect of substrate on electroplated copper sulphide thin films
Crossref DOI link: https://doi.org/10.1007/s10854-014-2310-7
Published Online: 2014-09-21
Published Print: 2014-12
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Bharathi, B.
Thanikaikarasan, S.
Kollu, Pratap
Chandrasekar, P. V.
Sankaranarayanan, K.
Shajan, X. Sahaya
Text and Data Mining valid from 2014-09-21