New insights into silver nanowires filled electrically conductive adhesives
Crossref DOI link: https://doi.org/10.1007/s10854-014-2475-0
Published Online: 2014-11-09
Published Print: 2015-02
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Wang, Y. H.
Xiong, N. N.
Xie, H.
Zhao, Y. Z.
Li, Jingze
Text and Data Mining valid from 2014-11-09