Size effect on interfacial reactions of Sn–3.0Ag–0.5Cu solder balls on Cu and Ni–P pads
Crossref DOI link: https://doi.org/10.1007/s10854-014-2485-y
Published Online: 2014-11-09
Published Print: 2015-02
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Huang, M. L.
Yang, F.
Text and Data Mining valid from 2014-11-09