IMC growth and shear strength of Sn–Ag–Cu/Co–P ball grid array solder joints under thermal cycling
Crossref DOI link: https://doi.org/10.1007/s10854-014-2489-7
Published Online: 2014-11-11
Published Print: 2015-02
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Yang, Donghua
Cai, Jian
Wang, Qian
Li, Jingwei
Hu, Yang
Li, Liangliang
Text and Data Mining valid from 2014-11-11