Interfacial reactions and diffusion path in gold–tin–nickel system during eutectic or thermo-compression bonding for 200 mm MEMS wafer level hermetic packaging
Crossref DOI link: https://doi.org/10.1007/s10854-015-2852-3
Published Online: 2015-02-25
Published Print: 2015-06
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Garnier, Arnaud
Baillin, Xavier
Hodaj, Fiqiri
Text and Data Mining valid from 2015-02-25