A solid-state bonding technique of large copper wires for high power devices operating at high temperature
Crossref DOI link: https://doi.org/10.1007/s10854-015-2864-z
Published Online: 2015-03-04
Published Print: 2015-06
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Chen, Yi-Ling
Wu, Yuan-Yun
Lee, Chin C.
Text and Data Mining valid from 2015-03-04