Indium, chromium and nickel-modified eutectic Sn–0.7 wt% Cu lead-free solder rapidly solidified from molten state
Crossref DOI link: https://doi.org/10.1007/s10854-015-3261-3
Published Online: 2015-06-03
Published Print: 2015-09
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Shalaby, Rizk Mostafa
Text and Data Mining valid from 2015-06-03