Heel crack propagation mechanism of cold-rolled Cu/Al clad ribbon bonding in harsh environment
Crossref DOI link: https://doi.org/10.1007/s10854-015-3355-y
Published Online: 2015-06-20
Published Print: 2015-09
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Park, Semin
Nagao, Shijo
Sugahara, Tohru
Suganuma, Katsuaki
Funding for this research was provided by:
Grants-in-Aid for Scientific Research (24226017)
Text and Data Mining valid from 2015-06-20