Could application of column-grid-array (CGA) technology result in inelastic-strain-free state-of-stress in solder material?
Crossref DOI link: https://doi.org/10.1007/s10854-015-3688-6
Published Online: 2015-09-07
Published Print: 2015-12
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Suhir, Ephraim
Ghaffarian, Reza
Nicolics, Johann
Text and Data Mining valid from 2015-09-07