Through-hole filling characteristics of solderable polymer composites with low melting point alloy fillers
Crossref DOI link: https://doi.org/10.1007/s10854-015-3842-1
Published Online: 2015-10-13
Published Print: 2016-01
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Lee, Jeong Il
Yim, Byung-Seung
Yun, Mu Seong
Kim, Jong-Min
Text and Data Mining valid from 2015-10-13