Thermostable Ag die-attach structure for high-temperature power devices
Crossref DOI link: https://doi.org/10.1007/s10854-015-3894-2
Published Online: 2015-10-15
Published Print: 2016-02
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Zhang, Hao
Nagao, Shijo
Suganuma, Katsuaki
Albrecht, Hans-Juergen
Wilke, Klaus
Funding for this research was provided by:
Grant-in-Aid for Scientific Research (S) (Grant No. 24226017)
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