The formation and conversion of intermetallic compounds in the Cu pillar Sn–Ag micro-bump with ENEPIG Cu substrate under current stressing
Crossref DOI link: https://doi.org/10.1007/s10854-015-4011-2
Published Online: 2015-11-07
Published Print: 2016-03
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Hsiao, Yu-Hsiang
Lin, Kwang-Lung
Funding for this research was provided by:
Ministry of Science and Technology, Taiwan (TW) (NSC 101-2221-E-006-117-MY3)
Text and Data Mining valid from 2015-11-07