Solid state bonding of silicon chips to copper substrates using silver with cavities
Crossref DOI link: https://doi.org/10.1007/s10854-015-4164-z
Published Online: 2015-12-15
Published Print: 2016-04
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Wu, Yuan-Yun
Chen, Yi-Ling
Lee, Chin C.
Funding for this research was provided by:
II-VI Foundation
Text and Data Mining valid from 2015-12-15