Expected stress relief in a bi-material inhomogeneously bonded assembly with a low-modulus-and/or-low-fabrication-temperature bonding material at the ends
Crossref DOI link: https://doi.org/10.1007/s10854-016-4461-1
Published Online: 2016-02-16
Published Print: 2016-06
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Suhir, E.
Text and Data Mining valid from 2016-02-16