Effect of Zn concentration on the interfacial reactions between Sn–3.0Ag–0.5Cu solder and electroplated Cu–xZn wetting layers (x = 0–43 wt%)
Crossref DOI link: https://doi.org/10.1007/s10854-016-4510-9
Published Online: 2016-02-13
Published Print: 2016-06
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Park, Jae-Yong
Kim, Young Min
Kim, Young-Ho
Text and Data Mining valid from 2016-02-13