Three-dimensional multi-layer through-hole filling properties of solderable polymer composites with low-melting-point alloy fillers
Crossref DOI link: https://doi.org/10.1007/s10854-016-4553-y
Published Online: 2016-02-20
Published Print: 2016-06
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Lee, Jeong Il
Yim, Byung-Seung
Shin, Dongjun
Kim, Jong-Min
Text and Data Mining valid from 2016-02-20