Could dynamic strength of a bonding material in an electronic device be assessed from static shear-off test data?
Crossref DOI link: https://doi.org/10.1007/s10854-016-4617-z
Published Online: 2016-03-11
Published Print: 2016-07
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Suhir, Ephraim
Morris, James E.
Wang, Liang
Yi, Sung
Text and Data Mining valid from 2016-03-11