3D NiS dendritic arrays on nickel foam as binder-free electrodes for supercapacitors
Crossref DOI link: https://doi.org/10.1007/s10854-016-4878-6
Published Online: 2016-04-26
Published Print: 2016-08
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Zhang, Yan
Xu, Jie
Zhang, Yingjiu
Hu, Xiaoyang
Funding for this research was provided by:
Key Scientific and Technological Project of Henan Province (NO. 082101510007)
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