Effect of electron flow on the microstructure and mechanical property of Cu/Sn–30Bi/Cu solder joint
Crossref DOI link: https://doi.org/10.1007/s10854-016-6085-x
Published Online: 2016-11-18
Published Print: 2017-03
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Lai, Zhongmin
Kong, Xinda
You, Qingrong
License valid from 2016-11-18