Effect of thin gold/nickel coating on the microstructure, wettability and hardness of lead-free tin–bismuth–silver solder
Crossref DOI link: https://doi.org/10.1007/s10854-016-6136-3
Published Online: 2016-11-28
Published Print: 2017-03
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Gain, Asit Kumar
Zhang, Liangchi
Funding for this research was provided by:
The University of New South Wales ((InfoEd Ref: RG124326))
License valid from 2016-11-28