Polarized evolution of interfacial intermetallic compounds (IMCs) in interconnects under electromigration (EM)
Crossref DOI link: https://doi.org/10.1007/s10854-017-6596-0
Published Online: 2017-02-22
Published Print: 2017-06
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Zhu, Ze http://orcid.org/0000-0003-2331-1752
Li, Yi
Chan, Yan Cheong
Wu, Fengshun
Funding for this research was provided by:
Research Grants Council, University Grants Committee (N_CityU101/12)
National Natural Science Foundation of China (61261160498)
License valid from 2017-02-22