High temperature MEMS packages: die-attach solutions for LiNbO3 under low bonding pressures
Crossref DOI link: https://doi.org/10.1007/s10854-017-6605-3
Published Online: 2017-02-24
Published Print: 2017-06
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Roshanghias, Ali
Bruckner, Gudrun
Binder, Alfred
License valid from 2017-02-24