Effect of interfacial dissolution on electromigration failures at metals interface
Crossref DOI link: https://doi.org/10.1007/s10854-017-7391-7
Published Online: 2017-07-06
Published Print: 2017-10
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Lin, E. J.
Hsu, Y. C.
Chuang, Y. C.
Liu, C. Y.
License valid from 2017-07-06