Low temperature Cu–Cu bonding by transient liquid phase sintering of mixed Cu nanoparticles and Sn–Bi eutectic powders
Crossref DOI link: https://doi.org/10.1007/s10854-017-7554-6
Published Online: 2017-07-20
Published Print: 2017-11
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Khairi Faiz, M.
Bansho, Kazuma
Suga, Tadatomo
Miyashita, Tomoyuki
Yoshida, Makoto
License valid from 2017-07-20