Effect of particle size distribution on the mechanical and electrical properties of reverse-offset printed Sn–Ag–Cu solder bumps
Crossref DOI link: https://doi.org/10.1007/s10854-018-0021-1
Published Online: 2018-10-08
Published Print: 2018-12
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Son, Min-Jung
Jeong, Jae Won
Kim, Hyunchang
Lee, Taik-Min
Lee, Hoo-Jeong
Kim, Inyoung
Text and Data Mining valid from 2018-10-08
Article History
Received: 20 June 2018
Accepted: 5 September 2018
First Online: 8 October 2018