Ultra-thin metallic glass film of Zr–Cu–Ni–Al–N as diffusion barrier for Cu–Si interconnects under fully recrystallized temperature
Crossref DOI link: https://doi.org/10.1007/s10854-018-0086-x
Published Online: 2018-09-20
Published Print: 2018-11
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Kuo, Pei-Hung
Lee, Joseph
Duh, Jenq-Gong
Text and Data Mining valid from 2018-09-20
Article History
Received: 7 August 2018
Accepted: 18 September 2018
First Online: 20 September 2018