Relationship between the thermal stress and structures of thermal-cycling-induced cracks in electroless nickel plating on metalized substrates
Crossref DOI link: https://doi.org/10.1007/s10854-019-00880-6
Published Online: 2019-02-19
Published Print: 2019-03
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Fukuda, Shinji
Shimada, Kazuhiko
Izu, Noriya
Miyazaki, Hiroyuki
Iwakiri, Shoji
Hirao, Kiyoshi
Text and Data Mining valid from 2019-02-19
Article History
Received: 9 July 2018
Accepted: 4 February 2019
First Online: 19 February 2019