Interfacial reactions and mechanical properties of Sn–3.0Ag–0.5Cu solder with pure Pd or Pd(P) layers containing thin-Au/Pd/Ni(P) surface-finished PCBs during aging
Crossref DOI link: https://doi.org/10.1007/s10854-020-02950-6
Published Online: 2020-01-29
Published Print: 2020-03
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Kim, Jungsoo
Back, Jong-Hoon
Jung, Seung-Boo
Yoon, Jeong-Won http://orcid.org/0000-0001-8708-542X
Funding for this research was provided by:
Ministry of Trade, Industry and Energy (20003904)
Text and Data Mining valid from 2020-01-29
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Article History
Received: 19 November 2019
Accepted: 20 January 2020
First Online: 29 January 2020