Microstructures, interface reaction, and properties of Sn–Ag–Cu and Sn–Ag–Cu–0.5CuZnAl solders on Fe substrate
Crossref DOI link: https://doi.org/10.1007/s10854-020-03220-1
Published Online: 2020-03-19
Published Print: 2020-05
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Zhang, Liang http://orcid.org/0000-0003-3757-7009
Long, Wei-min
Wang, Feng-jiang
Funding for this research was provided by:
State Key Lab of Advanced Welding and Joining, Harbin Institute of Technology (AWJ-19Z04)
Text and Data Mining valid from 2020-03-19
Version of Record valid from 2020-03-19
Article History
Received: 16 January 2020
Accepted: 6 March 2020
First Online: 19 March 2020