Fast formation of Ni–Sn intermetallic joints using Ni–Sn paste for high-temperature bonding applications
Crossref DOI link: https://doi.org/10.1007/s10854-020-04068-1
Published Online: 2020-07-28
Published Print: 2020-09
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Jeong, So-Eun
Jung, Seung-Boo
Yoon, Jeong-Won http://orcid.org/0000-0001-8708-542X
Text and Data Mining valid from 2020-07-28
Version of Record valid from 2020-07-28
Article History
Received: 7 April 2020
Accepted: 22 July 2020
First Online: 28 July 2020