Crossmark

Mechanical properties and microstructural evolution of solder alloys fabricated using laser-assisted bonding

Crossref DOI link: https://doi.org/10.1007/s10854-020-04819-0

Published Online: 2020-11-15

Published Print: 2020-12

Update policy: https://doi.org/10.1007/springer_crossmark_policy

Authors

Joo, Hong-Sub

Lee, Choong-Jae

Min, Kyung Deuk

Hwang, Byeong-Uk

Jung, Seung-Boo http://orcid.org/0000-0002-7360-9859
License Information

Text and Data Mining valid from 2020-11-15

Version of Record valid from 2020-11-15
More Information

Article History

Received: 7 July 2020

Accepted: 3 November 2020

First Online: 15 November 2020