Effect of Bi addition on the shear strength and failure mechanism of low-Ag lead-free solder joints
Crossref DOI link: https://doi.org/10.1007/s10854-020-04982-4
Published Online: 2021-01-01
Published Print: 2021-01
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Chen, Yinbo
Meng, Zhi-Chao
Gao, Li-Yin
Liu, Zhi-Quan http://orcid.org/0000-0001-7097-8977
Funding for this research was provided by:
The National Key R&D Program of China (No. 2017YFB0305700)
Text and Data Mining valid from 2021-01-01
Version of Record valid from 2021-01-01
Article History
Received: 8 October 2020
Accepted: 26 November 2020
First Online: 1 January 2021