Formation and nanomechanical properties of intermetallic compounds in electrodeposited Cu–Sn–Co multilayers
Crossref DOI link: https://doi.org/10.1007/s10854-021-05612-3
Published Online: 2021-03-15
Published Print: 2021-04
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Goh, Yi Sing
Goh, Yingxin http://orcid.org/0000-0002-4489-8727
Chia, Pay Ying
Haseeb, A. S. M. A.
Text and Data Mining valid from 2021-03-15
Version of Record valid from 2021-03-15
Article History
Received: 12 November 2020
Accepted: 21 February 2021
First Online: 15 March 2021
Declarations
:
: This work declares no conflict of interest.