Thermomechanical reliability of a Cu/Sn-3.5Ag solder joint with a Ni insertion layer in flip chip bonding for 3D interconnection
Crossref DOI link: https://doi.org/10.1007/s10854-021-05819-4
Published Online: 2021-04-19
Published Print: 2021-05
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Tang, Chu
Zhu, Wenhui
Chen, Zhuo
Wang, Liancheng http://orcid.org/0000-0002-2100-3089
Text and Data Mining valid from 2021-04-19
Version of Record valid from 2021-04-19
Article History
Received: 29 September 2020
Accepted: 22 March 2021
First Online: 19 April 2021
Declarations
:
: The authors declare that they have no conflict of interest.