Using Ozawa method to study the curing kinetics of electrically conductive adhesives
Crossref DOI link: https://doi.org/10.1007/s10973-014-3902-4
Published Online: 2014-07-06
Published Print: 2014-09
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Cui, Hui-Wang
Jiu, Jin-Ting
Nagao, Shijo
Sugahara, Tohru
Suganuma, Katsuaki
Uchida, Hiroshi
Text and Data Mining valid from 2014-07-06