Using the Friedman method to study the thermal degradation kinetics of photonically cured electrically conductive adhesives
Crossref DOI link: https://doi.org/10.1007/s10973-014-4195-3
Published Online: 2014-10-01
Published Print: 2015-01
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Cui, Hui-Wang
Jiu, Jin-Ting
Sugahara, Tohru
Nagao, Shijo
Suganuma, Katsuaki
Uchida, Hiroshi
Schroder, Kurt A.
Text and Data Mining valid from 2014-10-01