Thermal runaway evaluation using DSC1, VSP2, and kinetics models on Cu etchant and its waste in high-tech etching process
Crossref DOI link: https://doi.org/10.1007/s10973-020-10094-2
Published Online: 2020-08-03
Published Print: 2021-04
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Lin, Yu-Jung
Lin, Zih-Syuan
Wang, Yih-Wen http://orcid.org/0000-0003-1805-3234
Funding for this research was provided by:
China Medical University (CMU-108-MF-119)
Text and Data Mining valid from 2020-08-03
Version of Record valid from 2020-08-03
Article History
Received: 16 April 2020
Accepted: 16 July 2020
First Online: 3 August 2020