A Comparison of CF4, CHF3 and C4F8 + Ar/O2 Inductively Coupled Plasmas for Dry Etching Applications
Crossref DOI link: https://doi.org/10.1007/s11090-021-10198-z
Published Online: 2021-07-07
Published Print: 2021-11
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Lim, Nomin
Efremov, Alexander
Kwon, Kwang-Ho
Text and Data Mining valid from 2021-07-07
Version of Record valid from 2021-07-07
Article History
Received: 4 March 2021
Accepted: 29 June 2021
First Online: 7 July 2021