Growth Kinetics of Intermetallic Compounds During Interfacial Reactions Between SnAgCuGa Lead-Free Solder and Cu Substrate
Crossref DOI link: https://doi.org/10.1007/s11106-017-9877-5
Published Online: 2017-07-17
Published Print: 2017-05
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Chen, HuiMing
Shang, Genfeng
Hu, Wang Yi
Wang, Hang
License valid from 2017-05-01