Thermal Analysis of the Stress-Strain State of the Surface Layer of Ground Si3N4–TiC-Ceramics
Crossref DOI link: https://doi.org/10.1007/s11148-021-00560-1
Published Online: 2021-07-26
Published Print: 2021-05
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Kuzin, V. V.
Grigor’ev, S. N.
Volosova, M. A.
Text and Data Mining valid from 2021-05-01
Version of Record valid from 2021-05-01
Article History
Received: 11 January 2021
First Online: 26 July 2021